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Round Sputtering Source

 Ultool’s round sputtering sources are built to last by using vacuum compatible materials (stainless steel and OFCH copper), isolating cooling water and magnet module totally from vacuum environment, and connecting utilities through standard vacuum couplings in atmospheric side. The magnetic field is carefully modeled and designed to provide higher deposition rate, better uniformity, and more target utilization. By mounting high strength rare earth magnet in the source, balanced or unbalanced sputtering process can help customers to deposit conductor, semiconductor, dielectrics, and compound films.

The round sputtering source family includes 1”, 2”, 3”, 4”, 6”, and 8” target configurations. They are amounted onto vacuum chamber through ” and 1” stainless tubing. For special source sizes and mount methods, please contact us at 412-607-8756 or email to sales@ultool.com. To respect our customers, we provide 18 months warranty on all of our round sources.

Advantages
  • Higher deposition rates.
  • Better uniformity.
  • More target utilization.
  • Balanced and unbalanced.
  • Easy installation.
  • 18 months and full service support.
  • Last but not least, significant price advantage to lend our customer an edge of cost reduction.
                                                    




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